DALIAN UNIVERSITY OF TECHNOLOGY
Login
中文
Home
Scientific Research
Research Projects
Published Books
Patents
Paper Publications
Research Field
Teaching Research
Teaching Achievement
Teaching Information
Teaching Resources
Awards and Honours
Other Rewards
Academic Honor
Scientific Awards
Enrollment Information
Student Information
My Album
Blog
Current position:
Home
>>
Scientific Research
>>
Paper Publications
Dongming Guo
Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[411]张振宇, 郭东明, 康仁科, 高航, 李岩, Zhang, Z.(zzy@dlut.edu.cn).软脆功能晶体碲锌镉化学机械抛光[J],机械工程学报,2008,44(12):215-220,225
[412]张永顺, 于宏海, 王楠, 杨振强, 郭东明, Zhang, Y.-S..胶囊式微型机器人驱动转矩的研究[J],机器人,2008,30(6):516-520,527
[413]李庆忠, 张然, 郭东明.非离子型活性剂在ULSI碱性Cu抛光液中的性能[J],半导体技术,2008,33(11):972-975
[414]Wang Xuyue, Xu Wenji, Lei Mingkai, Guo Dongming.Laser Milling of Al(2)O(3) Ceramic Based on Deteriorative Layer Controlled[A],2008,83-86:1-6
[415]Sun, Y., Li, D., Ren, F., Guo, Y.(Yuwen.Sun@dlut.edu.cn).Predictive Force Model Based Variable Feedrate Scheduling for High-Efficiency NC machining[J],Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics),2008,5315 LNAI(PART 2):1076-1085
[416]Zhang, Zhenyu, Gao, Hang, Jie, Wanqi, Guo, Dongming, Kang, Renke, Li, Yan, ZY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining Technol, Dalian 116024, Peoples R China..Chemical mechanical polishing and nanomechanics of semiconductor CdZnTe single crystals[J],SEMICONDUCTOR SCIENCE AND TECHNOLOGY,2008,23(10)
[417]Qiao, Y.P., Kang, R.K., Jin, Z.J., Guo, D.M..The characteristics of surface residual stresses by plane grinding invar and the effects of them ...[A],2008,53-54:293-298
[418]Guo, D.M., Qin, N., Kang, R.K., Jin, Z.J..Novel measurement technique on 3D surface topography of polishing pad[A],2008,53-54:265-272
[419]Su, J.X., Chen, X.Q., Du, Guo, D.M., Kang, R.K..Analyzing on nonuniformity of material removal in silicon wafer CMP based on abrasive movement tr...[A],2008,53-54:119-124
[420]Xu, C., Guo, D. M., Kang, R. K., Jin, Z. J., Huo, F. W..Friction-based in Situ Endpoint Detection of Copper CMP Process[A],2008,53-54:125-130
total751 42/76
first
previous
next
last
Page