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In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage

Release Time:2022-10-12  Hits:

Date of Publication: 2022-10-03

Journal: 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)

Page Number: 974-979

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