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Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

Release Time:2022-10-12  Hits:

Date of Publication: 2022-10-02

Journal: MICROELECTRONICS AND RELIABILITY

Institution: 机械工程学院

Volume: 80

Page Number: 55-67

ISSN: 0026-2714

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