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Associate Professor Supervisor of Master's Candidates

Paper Publications

[91]张翔, chenjun, Lin Li, liximeng.复合材料孔隙形貌特征对超声波散射衰减影响分析[J],中国机械工程,2022,21(14):1735-1741
[92]梁向雨, Lin Li, chenjun, 丁珊珊, liximeng.孔隙尺寸离散度大的碳纤维增强复合材料随机孔隙建模方法研究[J],航空材料学报,2022,3:81-85
[93]chenjun, 李伟, 贺冬云, haoshengzhi.强流脉冲电子束表面改性FeCrAl涂层的显微组织及耐高温腐蚀性能研究[J],表面技术,2022,49(5):200-206
[94]chenjun, Lin Li, Lin Guoqiang, haoshengzhi, wangfugang.强流脉冲离子束辐照对电弧离子镀TiNbN硬质薄膜摩擦磨损性能的影响[J],强激光与粒子束,2022,6:1003-1006
[95]chenjun, 杨孟哲, Lin Li, LUO Zhongbing.珠光体组织转变的非线性超声表征[J],无损检测,2022,2:1-4
[96]侯云霞, chenjun, Lin Li.Lamb波在薄铝板无损评价中的模态识别与应用[J],无损检测,2009,07:517-519
[97]Guo, Bingfeng, ANIL KUNWAR, Zhao Ning, chenjun, wangyunpeng, mahaitao.Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[98]mahaitao, mahaoran, ANIL KUNWAR, Shang, Shengyan, wangyunpeng, chenjun, Mingliang Huang, Zhao Ning.Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE MATERIALS IN ELECTRONICS,2018,29(1):602-613
[99]马浩然, 董冲, 赏敏, M.M. Hussain, wangyunpeng, Xiaogan Li, mahaitao, chenjun.Temperature-induced effect and control of Cu3Sn on the rotation of orientation-preferred Cu6Sn5 c...[J],Materials Characterization,2021,171:11083-
[100]Sun, Liying, Wang, Chen, Shang, Shengyan, chenjun, wangyunpeng, mahaitao.Study on the coordination agent system of Sn-Ag-Cu ternary alloy co-deposition[A],2021

total163 10/17

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