DALIAN UNIVERSITY OF TECHNOLOGY
Login
中文
Home
Scientific Research
Research Projects
Published Books
Patents
Paper Publications
Research Field
Teaching Research
Teaching Achievement
Teaching Information
Teaching Resources
Awards and Honours
Other Rewards
Academic Honor
Scientific Awards
Enrollment Information
Student Information
My Album
Blog
Current position:
Home
>>
Scientific Research
>>
Paper Publications
陈军
Personal Information
Associate Professor Supervisor of Master's Candidates
Paper Publications
[101]Guo, Bingfeng, ANIL KUNWAR, Zhao Ning, chenjun, wangyunpeng, mahaitao.Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[102]mahaitao, mahaoran, ANIL KUNWAR, Shang, Shengyan, wangyunpeng, chenjun, Mingliang Huang, Zhao Ning.Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE MATERIALS IN ELECTRONICS,2018,29(1):602-613
[103]马浩然, 董冲, 赏敏, M.M. Hussain, wangyunpeng, Xiaogan Li, mahaitao, chenjun.Temperature-induced effect and control of Cu3Sn on the rotation of orientation-preferred Cu6Sn5 c...[J],Materials Characterization,2021,171:11083-
[104]Sun, Liying, Wang, Chen, Shang, Shengyan, chenjun, wangyunpeng, mahaitao.Study on the coordination agent system of Sn-Ag-Cu ternary alloy co-deposition[A],2021
[105]mahaoran, lishichang, Yao, M.J., wangyunpeng, chenjun, Zhao Ning, mahaitao.The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows[A],2017,1323-1326
[106]Ma, H. R., lishichang, Yao, M. J., wangyunpeng, chenjun, Zhao Ning, mahaitao.The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows[A],2017,1323-1326
[107]chenjun, 乔丹, jinshijie.Nondestructive evaluation of microstructure degradation of pearlitic steel[A],2020
[108]Dong, Chong, Ma, Haoran, Hussain, MuhammadMuzammal, Sun, Liying, chenjun, wangyunpeng, Li, Xiaogan, mahaitao.Significant effect of orientation on Cu6Sn5 coarsening behavior in isothermal aging process[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2020,31(23):21335-21341
[109]Ma, H. R., Dong, C., Priyanka, P., Wang, Y. P., Li, X. G., H. T., Chen, J., HT, Chen, J (corresponding author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Continuous growth and coarsening mechanism of the orientation-preferred Cu6Sn5 at Sn-3.0Ag/(001...[J],MATERIALS CHARACTERIZATION,2020,166
[110]陈军, 李伟, 贺冬云, 郝胜智.强流脉冲电子束表面改性FeCrAl涂层的显微组织及耐高温腐蚀性能研究[J],表面技术,2020,49(5):200-206
total167 11/17
first
previous
next
last
Page