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Associate Professor Supervisor of Master's Candidates

Paper Publications

[111]Ma, H. R., Dong, C., Zhao, N., Wang, Y. P., Li, X. G., H. T., Chen, J., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
[112]Lu, Jian, Hu, Fangting, Zhao, Limin, Chen, Jun, Hao, Shengzhi, SZ (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China..Design and experimental study of high-voltage pulsed penning discharge source with grid electro...[J],VACUUM,2019,169
[113]丁珊珊, 罗忠兵, 陈军, 刘欢, 林莉, Lin, L.(linli@dlut.edu.cn).基于数值计算方法的CFRP层板二维细观形貌多孔隙超声散射衰减[J],复合材料学报,2013,31(3):692-698
[114]Peng, Wenhai, Hao, Shengzhi, Zhao, Limin, Chen, Jun, Li, Wei, SZ (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser, Minist Educ, Ion & Electron Beams, Dalian 116024, Peoples R China..Formation mechanism of graphite nanospheres in W-C-Co system under high current pulsed electron...[J],MATERIALS LETTERS,2019,244:207-210
[115]Peng, Wenhai, Hao, Shengzhi, Chen, Jun, Li, Wei, Zhao, Limin, Deng, SZ (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China..Surface composite microstructure and improved mechanical property of YG10X cemented carbide ind...[J],INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS,2019,78:233-239
[116]陈军, 刘国彩, 林莉, 罗忠兵.铁素体不锈钢晶粒度的非线性超声表征[J],无损检测,2018,40(7):15-18,81
[117]Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Raback, Peter, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205
[118]Guo, Bingfeng, Kunwar, Anil, Zhao, Ning, Wang, Yunpeng, Ma, Haitao, Chen, Jun, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[119]Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and coolin...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[120]Kunwar, Anil, Guo, Bingfeng, Song, Xueguan, Zhao, Ning, Wang, Yunpeng, Chen, Jun, Ma, Haitao, Shang, Shengyan, Raback, Peter, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2018,93:186-196

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