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Associate Professor Supervisor of Master's Candidates

Paper Publications

[121]Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Raback, Peter, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205
[122]Guo, Bingfeng, Kunwar, Anil, Zhao, Ning, Wang, Yunpeng, Ma, Haitao, Chen, Jun, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[123]Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and coolin...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[124]Kunwar, Anil, Guo, Bingfeng, Song, Xueguan, Zhao, Ning, Wang, Yunpeng, Chen, Jun, Ma, Haitao, Shang, Shengyan, Raback, Peter, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2018,93:186-196
[125]郝胜智, 陈军.Surface composite microstructure and improved mechanical property of YG10X cemented carbide induc...[J],International Journal of Refractory Metals & Hard Materials,2018,78:233-239
[126]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS RELIABILITY,2018,80:55-67
[127]Ma, Haitao, Haoran, Kunwar, Anil, Shang, Shengyan, Chen, Jun, Huang, Mingliang, Zhao, Ning, Wang, Yunpeng, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
[128]Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
[129]Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96
[130]Ma, Haoran, Wang, Yunpeng, Chen, Jun, Kunwar, Anil, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111

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