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Associate Professor Supervisor of Master's Candidates

Paper Publications

[121]郝胜智, 陈军.Surface composite microstructure and improved mechanical property of YG10X cemented carbide induc...[J],International Journal of Refractory Metals & Hard Materials,2018,78:233-239
[122]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS RELIABILITY,2018,80:55-67
[123]Ma, Haitao, Haoran, Kunwar, Anil, Shang, Shengyan, Chen, Jun, Huang, Mingliang, Zhao, Ning, Wang, Yunpeng, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
[124]Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
[125]Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96
[126]Ma, Haoran, Wang, Yunpeng, Chen, Jun, Kunwar, Anil, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
[127]Ma, H.R., Wang, Y.P., Chen, J., H.T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multip...[A],2017,1402-1405
[128]Ding, S. S., Jin, S. J., Luo, Z. B., Chen, J., Lin, L., L (reprint author), Dalian Univ Technol, NDT & E Lab, Dalian 116085, Peoples R China..Researches on the Ultrasonic Scattering Attenuation of Carbon Fibre Reinforced Plastics with 2D...[J],ACOUSTICAL PHYSICS,2017,63(4):490-495
[129]陈军, 杨孟哲, 林莉, 罗忠兵.珠光体组织转变的非线性超声表征[J],无损检测,2017,39(2):1-4
[130]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, Ma, Haitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017,974-979

total163 13/17

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