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陈军
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Associate Professor Supervisor of Master's Candidates
Paper Publications
[131]Ma, Haoran, Wang, Yunpeng, Chen, Jun, Kunwar, Anil, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
[132]Ma, H.R., Wang, Y.P., Chen, J., H.T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multip...[A],2017,1402-1405
[133]Ding, S. S., Jin, S. J., Luo, Z. B., Chen, J., Lin, L., L (reprint author), Dalian Univ Technol, NDT & E Lab, Dalian 116085, Peoples R China..Researches on the Ultrasonic Scattering Attenuation of Carbon Fibre Reinforced Plastics with 2D...[J],ACOUSTICAL PHYSICS,2017,63(4):490-495
[134]陈军, 杨孟哲, 林莉, 罗忠兵.珠光体组织转变的非线性超声表征[J],无损检测,2017,39(2):1-4
[135]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, Ma, Haitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017,974-979
[136]金士杰, 罗忠兵, 陈军, 林莉.Researches on the ultrasonic scattering attenuation of CFRP with 2D real morphology void model[J],Acoustical Physics,2017,63(4):490-495
[137]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017,1087-1091
[138]Ma, H. R., Wang, Y. P., Chen, J., H. T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during mult...[A],2017,1402-1405
[139]王婧云, 张侃, 林莉, 陈军, 叶伟龙.超声相控阵三维可视成像技术的发展与应用概述[J],无损探伤,2015,39(6):32-34
[140]刘欢, 丁珊珊, 陈军, 金士杰, 罗忠兵, 刘伟华, 林莉.基于波形相关性的CFRP孔隙率统计研究[J],无损探伤,2015,39(3):13-18
total168 14/17
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