Current position: Home >> Scientific Research >> Patents

一种降低SiC MOS界面态密度的表面预处理方法

Release Time:2019-03-09  Hits:

First Author: Dejun WANG

Disigner of the Invention: Qin Fuwen

Authorization Number: 201510735852.x

Prev One:一种β-碳化硅薄膜的制备方法

Next One:采用金属基片制备垂直GaN基LED芯片的设备