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纳米级球形硅基介孔材料的制备及粒径和形貌控制方法

Release Time:2022-10-19  Hits:

First Author: 谷琳

Disigner of the Invention: 郭新闻,Liu Min,Zhang Anfeng,侯珂珂,代成义

Application Number: CN102126729A

Authorization Number: CN201110028385.9

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