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赵杰
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[301]聂德福, 张慧星, 赵杰, Nie, D.-F.(dove_ndf@sina.com.cn).X70管线钢显微组织对室温蠕变性能的影响[J],材料热处理学报,2006,27(4):44-48
[302]程从前, 赵杰, 杨朋, 朱凤.Sn-3Ag/Cu接头在钎焊和时效中IMC的生长和晶体取向分析[J],材料热处理学报,2006,27(4):82-86
[303]Zhao, Jie, Qi, Lin, Wang, Lai.Effect of Bi on the kinetics of intermetallics growth in Sn-3Ag-0.5Cu/Cu solder joint[A],2006,59-+
[304]聂德福, 马海涛, 赵杰.X70钢室温蠕变及对疲劳裂纹扩展行为的影响[A],2006,91-94
[305]聂德福, 赵杰, 莫涛.X70管线钢的室温蠕变及其对流变应力的影响[J],材料工程,2006,6:58-61
[306]赵杰, 朱凤, 尹德国, 王来, Zhao, J..强磁场下Sn-3Ag-0.5Cu/Cu界面金属间化合物生长行为[J],大连理工大学学报,2006,46(2):202-206
[307]冯炜, 邢丽, 赵杰.考虑组织劣化影响的耐热钢剩余寿命预测[A],2006,368-372
[308]马海涛, 赵杰, 王来, 韩双起, 李卫东.催化车间旋风分离器焊缝开裂原因分析[A],2006,508-511
[309]Cheng, Cong-qian, Yang, Peng, Zhao, Jie, Zhu, Feng, Song, Qmg-Yang.The growth behavior of inteimetallic compound layers of Sn-3Ag/Cu and Sn/Cu joints during solde...[A],2006,12-+
[310]于大全, 段莉蕾, 赵杰, 王来, C.M.L.Wu, Yu, D.-Q..Sn-3.5Ag/Cu界面金属间化合物的生长行为研究[J],材料科学与工艺,2005,13(5):532-536
total335 31/34
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