个人信息Personal Information
教授
博士生导师
硕士生导师
性别:女
毕业院校:大连理工大学
学位:博士
所在单位:材料科学与工程学院
学科:材料物理与化学
办公地点:三束实验室2号楼302室
联系方式:0411-84708380-8302
电子邮箱:lixiaona@dlut.edu.cn
Barrierless Cu-Ni-Nb thin films on silicon with high thermal stability and low electrical resistivity
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论文类型:期刊论文
发表时间:2013-12-28
发表刊物:JOURNAL OF MATERIALS RESEARCH
收录刊物:SCIE、Scopus
卷号:28
期号:24
页面范围:3367-3373
ISSN号:0884-2914
摘要:In this paper, we demonstrate a thin film Cu-Ni-Nb alloy deposited directly on silicon, without a designated barrier, showing very high thermal stability at a temperature up to 700 degrees C for 1 h. Thin [Nb-Ni-12]Cu-x films were sputter deposited and annealed, and their material and electrical properties were studied. The results can be explained by the "cluster-plus-glue atom" model for stable solid solutions, where [Nb-Ni-12] cuboctahedral clusters are embedded in a Cu matrix. In this model, the clusters are congruent with the Cu minimizing atomic interactions allowing a good stability. The properties of the films were found to be affected by the Ni/Nb ratios. Especially, the ( Nb1.2/13.2Ni12/13.2)(0.3)Cu-99.7 film annealed at 500 degrees C for 1 h had the lowest electrical resistivity of about 2.7 mu Omega cm. And even after 40 h annealing at 500 degrees C, it maintained a low resistivity of about 2.8 mu Omega cm, demonstrating extremely high stabilities against silicide formation.