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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：女
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料物理与化学
办公地点：知远楼B505
电子邮箱：
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- [1]李晓娜.王清,董闯.Cuboidal γ'phase coherent precipitation-strengthened Cu–Ni–Al alloys with high softening temperature[J],Acta Materialia,2021,203:116458-
- [2]李晓娜.王清,董闯.Performance and local structure evolution of NbMoTaWV entropy-stabilized oxide thin films with variable oxygen content[J],Surface and Coatings Technology,2021,402:126326-
- [3]李晓娜.董闯.Synergistic reinforcement of Cu–Ni–Al films with dual nanostructure[J],Surface Engineering,2021
- [4]Li, Z. M..Li, XN (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Electron Beams, Dalian 116024, Peoples R China..Wang, Q.,Zheng, Y. H.,Yu, Q. X.,Cheng, X. T.,Li, N. J.,Bi, L. X.,Dong, C.,Li, X. N.,Wang, C. Y..Comparative studies on microstructures and properties of Cu-Ni-M alloys controlled by strong interaction between elements[J],JOURNAL OF ALLOYS AND COMPOUNDS,2019,805:404-414
- [5]Xiaona Li.Bing Hu,Chuang Dong,Xin Jiang.Structural evolution upon annealing of multi-layer Si/Fe thin films prepared by magnetron sputtering[A],2007,561-565(PART 2):1161-1164
- [6]Li, Hongming.Dong, C; Zhou, DY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat, Dalian 116024, Peoples R China..Dong, Chuang,Zhao, Yajun,Li, Xiaona,Zhou, Dayu.Quantitative Correlation between Electrical Resistivity and Microhardness of Cu-Ni-Mo Alloys via a Short-Range Order Cluster Model[J],JOURNAL OF ELECTRONIC MATERIALS,2019,48(1):312-320
- [7]Li, X. N..Li, XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China..Dong, C.,Wang, C. Y.,Wang, Q.,Zheng, Y. H.,Yu, Q. X.,Cheng, X. T.,Sun, W.,Li, Z. M..Precipitation evolution in Cu-x[Ni3Cr1] spinodal alloys under mismatch control[J],MATERIALS CHEMISTRY AND PHYSICS,2019,223:486-493
- [8]Yu, Q. X..Li, XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Elect Beams, Minist Educ, Dalian 116024, Peoples R China..Wang, C. Y.,Wang, Q.,Li, N. J.,Cheng, X. T.,Li, Z. M.,Zheng, Y. H.,Li, X. N.,Wei, K. R.,Dong, C..Cu-Ni-Sn-Si alloys designed by cluster-plus-glue-atom model[J],MATERIALS & DESIGN,2019,167
- [9]Cheng, Xiaotian.Li, XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Liaoning, Peoples R China..Wang, Chenyu,Dong, Chuang,Yu, Qingxiao,Zheng, Yuehong,Li, Xiaona,Li, Zhumin,Zhang, Yuanyuan.Microstructure evolution and strengthening mechanism of Cu-x[Ni3Mo] alloys[J],MATERIALS SCIENCE AND TECHNOLOGY,2019,35(1):98-106
- [10]Zheng, Yuehong.Li, XN (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Electron Beams, Dalian 116024, Peoples R China..Liu, Yubo,Dong, Chuang,Li, Zhuming,Cheng, Xiaotian,Li, Xiaona.Enhanced thermal stability of Cu alloy films by strong interaction between Ni and Zr (or Fe)[J],JOURNAL OF PHYSICS D-APPLIED PHYSICS,2018,51(13)