|
个人信息Personal Information
教授
博士生导师
硕士生导师
性别：女
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料物理与化学
办公地点：三束实验室2号楼302室
联系方式：0411-84708380-8302
电子邮箱：lixiaona@dlut.edu.cn
扫描关注
- [21]Li, Xiaona, Ding, Jianxin, Wang, Miao, Chu, Jinn P., Dong, Chuang, XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China..Application of cluster-plus-glue-atom model to barrierless Cu-Ni-Ti and Cu-Ni-Ta films[J],JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A,2014,32(6)
- [22]Li, X. N., Ding, J. X., Xu, L. Y., Bao, C. M., Chu, J. P., Dong, C., XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China..Carbon-doped Cu films with self-forming passivation layer[J],SURFACE & COATINGS TECHNOLOGY,2014,244:9-14
- [23]Li, X. N., Zhao, L. R., Bao, C. M., Chu, J. P., Dong, C., Wang, M., XN (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Electron Beams, Dalian 116024, Peoples R China..Thermal stability of barrierless Cu-Ni-Sn films[J],APPLIED SURFACE SCIENCE,2014,297:89-94
- [24]李晓娜, 董闯.Stability and Microstructure Characterization of Barrierless Cu (Sn, C) Films[J],Advanced Materials Research,2014,52(10):163-168
- [25]李晓娜, 李震, 董闯.基于团簇模型设计的Cu-Cu12-[Mx/(12+x)Ni12/(12+x)]5 (M = Si, Cr,Cr+Fe) 合金抗高温氧化研究[J],物理学报,2014,63(2)
- [26]Li, Xiao Na, Zhao, Li Rong, Zhen, Liu, Li Jun, Bao, Cui Min, Chu, Jinn P., Dong, Chuang, XN (reprint author), Dalian Univ Technol, Minist Educ, Sch Mech Engn, Key Lab Mat Modificat Laser, Dalian 116024, Peoples R China..Barrierless Cu-Ni-Nb thin films on silicon with high thermal stability and low electrical resis...[J],JOURNAL OF MATERIALS RESEARCH,2013,28(24):3367-3373
- [27]李晓娜, 赵丽荣, 李震, 刘立筠, 包翠敏, 朱瑾, 董闯.Barrierless Cu–Ni–Nb thin films on silicon with high thermal[J],J. Mater. Res.,2013,28(24):3367-3373
- [28]Li, X. N., Dong, C., Wang, Q., Chu, J. P., Zhang, X. Y., Liu, L. J., XN (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Electron Beams, Dalian 116024, Peoples R China..Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation[J],JOURNAL OF ELECTRONIC MATERIALS,2012,41(12):3447-3452
- [29]李晓娜, 刘立筠, 张心怡, 朱瑾, 王清, 董闯.Barrierless Cu-Ni-Mo Interconnect Films with High Thermal[J],Journal of ELECTRONIC MATERIALS,2012,41(12):3447-3452
- [30]Li Xiao-Na, Zheng Yue-Hong, Li Sheng-Bin, Dong Chuang, Li, XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beam, Minist Educt, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..beta-Fe3Si8M ternary alloy thin films prepared by magnetron sputtering[J],ACTA PHYSICA SINICA,2012,61(24)
- [31]Li X.-N., Zheng Y.-H., Li S.-B., Dong C., Li, X.-N., Key Laboratory of Materials Modification by Laser, Ion, Electron Beam, School of Materials Science, Engineering, Dalian University of Technology, Dalian 116024, China, email: lixiaona@dlut.edu.cn.-Fe3Si8M ternary alloy thin films prepared by magnetron sputtering[J],Wuli Xuebao/Acta Physica Sinica,2012,61(24)
- [32]Zhang, X. Y., Li, X. N., Nie, L. F., Chu, J. P., Wang, Q., Lin, C. H., Dong, C., XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China..Highly stable carbon-doped Cu films on barrierless Si[J],APPLIED SURFACE SCIENCE,2011,257(8):3636-3640
- [33]Li, X. N., S. B., Nie, L. F., H., Dong, C., Jiang, X., XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser, Ion & Electron Beam Minist Educ, 2 Linggong Rd, Dalian 116024, Liaoning Prov, Peoples R China..Preparation of amorphous FexSi(1-x) film using unbalanced magnetron sputtering[J],THIN SOLID FILMS,2010,518(24,SI):7390-7393
- [34]Nie, L. F., Li, X. N., Chu, J. P., Wang, Q., Lin, C. H., Dong, C., XN (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Electron Beams, Dalian 116024, Peoples R China..High thermal stability and low electrical resistivity carbon-containing Cu film on barrierless ...[J],APPLIED PHYSICS LETTERS,2010,96(18)
- [35]李晓娜.The Preparation for Cu(Sn) Films of Barrierless Interconnection[J],Materials Science Forum,2010,654(6):1744-1747
- [36]Fang, Yuanyuan, Li, Xiaona, Qi, Lin, Dongming, Zhao, Jie.The effect of thermal aging on tensile property of HR3C steel[A],2009,343-346
- [37]Li X.-N., Nie D., Dong C., Ma T.-C., Jin X., Zhang Z., Li, X.-N., Stt. Key Lab. Mat. Modification L., Department of Materials Engineering, Dalian University of Technology, Dalian 116024, China.Microstructure of -FeSi2 film synthesized by ion implantation[J],Wuli Xuebao/Acta Physica Sinica,2002,51(1):123-124
- [38]Yuehong Zheng, Chuang Dong, Kun Zhang, Lujie Jin, Xiaona Li, Xiaona Li.Effects of distribution and growth orientation of precipitates on oxidation resistance of Cu-Cu12...[J],Journal of Materials Research,2015,30(2)