个人信息Personal Information
教授
博士生导师
硕士生导师
性别:女
毕业院校:大连理工大学
学位:博士
所在单位:材料科学与工程学院
学科:材料物理与化学
办公地点:三束实验室2号楼302室
联系方式:0411-84708380-8302
电子邮箱:lixiaona@dlut.edu.cn
Thermal stability of barrierless Cu-Ni-Sn films
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论文类型:期刊论文
发表时间:2014-04-01
发表刊物:APPLIED SURFACE SCIENCE
收录刊物:SCIE、EI、Scopus
卷号:297
页面范围:89-94
ISSN号:0169-4332
关键字:Cu alloys; Thin film; Electrical resistivity; Silicide; Cluster-plus-glue-atom model
摘要:To increase the thermal stability against interface reaction, barrierless Cu-Ni-Sn seed layers, with compositions formulated according to the cluster-plus-glue-atom model for stable solid solutions, was investigated in this paper. In this model, Sn is dissolved in Cu via Ni which is soluble both with Cu and with Sn, and the stable solid solution is formulated as [Sn-Ni-12] Cu-x, where the Sn-centered [Sn-Ni-12] octahedral clusters are embedded in an FCC Cu matrix of x atoms. Cu-Ni-Sn films with various Ni/Sn ratios were deposited onto the Si(1 0 0) substrate by magnetron sputtering and were characterized for microstructure and for electrical resistivity. The (Sn-1.1/Ni-13.1(12)/(13.1))(0.3)Cu-99.7 (at.%) film, with its Ni/Sn composition ratio being close to the ideal 12/1 value of the model, showed the minimum electrical resistivity of 2.7 mu Omega cm on 500. C/1 h annealing among all the samples. The resistivity maintained as low as 2.8 mu Omega cm even after 400 degrees C/40h annealing. No Cu silicide was observed by XRD and TEM in this sample, though a minute amount of fine Cu-Sn compound precipitates was present. The superior diffusion inhibiting effect was attributed to Sn in solid solution via intermediate of Ni. (c) 2014 Elsevier B.V. All rights reserved.