Release Time:2019-03-09 Hits:
First Author: 宋满仓
Disigner of the Invention: Chong Liu,Minjie wang,庞中华,刘莹
Application Number: CN201010183529.3
Authorization Date: 2010-05-26
Authorization Number: CN101863104A
Prev One:一种微流控芯片热流道注塑成型模具
Next One:一种成型附有储液池的微流控芯片注塑模具