Current position: Home >> Scientific Research >> Patents

一种微流控芯片热流道注塑成型模具

Release Time:2019-03-09  Hits:

First Author: 宋满仓

Disigner of the Invention: Chong Liu,Minjie wang,杜立群,庞中华,刘莹

Application Number: CN201010300409.7

Authorization Date: 2010-01-18

Authorization Number: CN101786317A

Prev One:注射成型模块化直视式可视化实验装置

Next One:塑料微流控芯片的注塑成型工艺