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Date of Publication:2022-10-10

Journal:热固性树脂

Affiliation of Author(s):化工学院

Volume:27

Issue:4

Page Number:51-54

ISSN No.:1002-7432

Abstract:The curing behaviors and heat resistance of bisphenol F epoxy resin/DHPZ
   - DA bonding system using 1,2- dihydro -2 - (4 - aminophenyl) -4 -[4- (4
   - aminophenoxyl) phenyl] - phthalazin -1 - one(DHPZ - DA) as curing
   agent were investigated by DSC, TGA, infrared spectroscopy and shear
   strength testsing. The curing apparent activation energy were 80.1
   kJ/mol and 84.3 kJ/mol calculated by the Kissinger and Ozawa methods,
   respectively. The apparent reaction order obtained by the Crane equation
   was 0.93. The T_g of the adhesive system was higher than 200 ℃. The
   shear strength at room temperature and after aging at 150℃ for 24 h of
   the system with molar ratio of bisphenol F epoxy resin to DHPZ - DA 10:4
   were greater than 12MPa and showed good heat resistance.

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