location： Current position: Home >> Scientific Research >> Paper Publications

Warping of silicon wafers subjected to back-thinning process

Hits:

Indexed by:期刊论文

Date of Publication:2015-01-01

Journal:Precision Engineering

Volume:40

Issue:-

Page Number:87-93

Pre One:A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing with double-layer structure of polishing pad

Next One:带中心孔的复合超声变幅杆设计及性能分析
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep