Indexed by:会议论文
Date of Publication:2019-01-01
Included Journals:EI、CPCI-S
Abstract:Molecular dynamics simulations using Reactive Force Field (ReaxFF) are employed to study the silica glass chemical mechanical polishing (CMP) process in aqueous H2O2. The material removal mechanisms in CMP process are studied by analyzing the tribochemical process of silica glass. Results shows that the surface of silica glass is hydroxylated after the reaction with H2O2 solution. Through dehydrogenation and dehydroxylation, the Si-O-Si bridge bonds are formed between abrasive layer and silica glass surface. The chemical bonds between surface atoms and substrate atoms are broken due to the stretch of bridge bonds. The relationship between the sliding speed and the removal of atoms is also studied.
Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
Title : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
Gender:Male
Alma Mater:西北工业大学
Degree:Doctoral Degree
School/Department:机械工程学院
Discipline:Mechanical Manufacture and Automation. Mechatronic Engineering. Manufacturing Engineering of Aerospace Vehicle
Business Address:机械工程学院7191
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