Renke Kang
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Two-Step Electrochemical Mechanical Polishing of Pure Copper
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Indexed by:Journal Papers

Date of Publication:2019-11-07

Journal:ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY

Included Journals:EI、SCIE

Volume:8

Issue:11

Page Number:P699-P703

ISSN No.:2162-8769

Abstract:It is difficult to achieve low roughness in a short time with high material removal rate (MRR) at low polishing pressure by conventional CMP of copper. To solve this problem, a two-step electrochemical mechanical polishing (ECMP) method consisting of rough polishing and fine polishing at polishing pressure less than 0.3 psi is proposed. Then potentiodynamic polarization, potentiostatic polarization and ECMP experiments were conducted to verify the feasibility of the combined process. The results of rough polishing show that MRR of more than 1 mu m.min(-1) can be reached with hydroxyethylidene diphosphonic acid (HEDP) based electrolyte. Besides, the roughness can be improved from Ra 610.4 nmto Ra 155.0 nm after 20 min rough polishing. The roughness can be further improved to Ra 4.7 nm after 60 min fine polishing with glycine-benzotriazole (BTA) based electrolyte. The results demonstrated that the two-step ECMP is effective to achieve low surface roughness within a short time. (c) 2019 The Electrochemical Society.

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Title : 国际磨粒技术学会(International Committee of Abrasive Technology, ICAT)委员,中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员,中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员,中国机械工程学会特种加工分会超声加工技术委员会副主任,中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员,中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。

Gender:Male

Alma Mater:西北工业大学

Degree:Doctoral Degree

School/Department:机械工程学院

Discipline:Mechanical Manufacture and Automation. Mechatronic Engineering. Manufacturing Engineering of Aerospace Vehicle

Business Address:机械工程学院7191

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