Indexed by:期刊论文
Date of Publication:2015-01-01
Journal:CIRP ANNALS-MANUFACTURING TECHNOLOGY
Included Journals:SCIE、EI
Volume:64
Issue:1
Page Number:349-352
ISSN No.:0007-8506
Key Words:Surface integrity; Grinding; Silicon
Abstract:This study investigates diamond scratching at a high speed comparable to that in a grinding process on an ultraprecision grinder. Diamond tips are prepared for the study. The scratched silicon wafer is observed for changes in the surface layer with transmission electron microscopy. The observation discovers that an amorphous layer is formed on top of the pristine Si-I phase before the onset of chip formation. This discovery is different from the previous findings in which a damaged silicon layer is identified underneath the amorphous layer. Furthermore, no high pressure phase is found before the onset of chip formation. (C) 2015. CIRP.
Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
Title : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
Gender:Male
Alma Mater:西北工业大学
Degree:Doctoral Degree
School/Department:机械工程学院
Discipline:Mechanical Manufacture and Automation. Mechatronic Engineering. Manufacturing Engineering of Aerospace Vehicle
Business Address:机械工程学院7191
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