Indexed by:期刊论文
Date of Publication:2015-01-01
Journal:PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Included Journals:SCIE、EI
Volume:39
Page Number:161-166
ISSN No.:0141-6359
Key Words:Electrochemistry; Chemical polishing; Roughness; Patterned surface
Abstract:Stress free polishing method is preferred for a damage free surface of copper with ultra-flatness and ultra-smoothness. Such a surface offers a perfect substrate for integrated circuits and micro-electromechanical systems fabrication. A new polishing method, called electrogenerated chemical polishing (EGCP), is proposed based on the principle of the scanning electrochemical microscope (SECM) and the diffusion controlled chemical reaction. Roughness of a Cu surface is reduced from 100.5 nm to 3.6 nm by the proposed method. To demonstrate the planarization capability of this new method, a patterned Cu surface with an array of micro-columns is planarized with a peak-valley (PV) value from 4.7 mu m to 0.059 mu m. (C) 2014 Elsevier Inc. All rights reserved.
Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
Title : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
Gender:Male
Alma Mater:西北工业大学
Degree:Doctoral Degree
School/Department:机械工程学院
Discipline:Mechanical Manufacture and Automation. Mechatronic Engineering. Manufacturing Engineering of Aerospace Vehicle
Business Address:机械工程学院7191
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