康仁科
个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会(International Committee of Abrasive Technology, ICAT)委员,中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员,中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员,中国机械工程学会特种加工分会超声加工技术委员会副主任,中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员,中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别:男
毕业院校:西北工业大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点:机械工程学院7191
电子邮箱:kangrk@dlut.edu.cn
扫描关注
- [241]王科, 康仁科, 王军, Wang, K., Key laboratory for Precision, Non-traditional Machining of Ministry Education, Dalian University of Technology, Dalian 116024, China.抛光液中磨料和化学成分对单晶MgO基片化学机械抛光的影响[J],金刚石与磨料磨具工程,2009,6:19-23
- [242]Li Yan, Lang Yanju, Wang Jinghe, Gao Hang, Kang Renke, Kang, RK (reprint author), Dalian Univ Technol, Key Lab Minist Educ, China Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Nanomechanical behaviors of (110) and (111) CdZnTe crystals investigated by nanoindentation[J],RARE METALS,2009,28(6):570-575
- [243]Tian, Y.B., Zhou, L., Shimizu, J., Sato, H., Kang, R.K., Y. B.(ybtian@mx.ibaraki.ac.jp).A novel single step thinning process for extremely thin Si wafers[J],Advanced Materials Research,2009,76-78:434-439
- [244]Dong, Z., Huang, H., Kang, R., Z.(zhigangdong@126.com).Deformation and acoustic emission during nanoindentation on single crystal MgO (001) plane[J],Advanced Materials Research,2009,76-78:404-409
- [245]侯军, 康仁科, 郭东明, 彭孝军.表面活性剂在太阳能硅片清洗中的应用[A],2009,170-174
- [246]Wang Q., Cong W., Pei Z.J., Gao H., Kang R., Pei, Z. J., Department of Industrial, Manufacturing Systems Engineering, Kansas State University, Manhattan, KS 66506, United States, email: zpei@ksu.edu.Rotary ultrasonic machining of potassium dihydrogen phosphate (KDP) crystal: An experimental inve...[J],Journal of Manufacturing Processes,2009,11(2):66-73
- [247]郭晓光, 金洙吉, 邢英杰, 康仁科.《特种加工》课程多元化教学方法研究[J],科技资讯,2009,17:205,207
- [248]郭晓光, 郭东明, 康仁科, 金洙吉, Guo, X.-G., Key Laboratory for Precision, Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116021, China.机群系统上单晶硅磨削过程分子动力学仿真并行化研究[J],系统仿真学报,2009,21(10):2850-2854
- [249]Jin, Zhuji, Yuan, Zewei, Kang, Renke, Dong, Boxian, ZW (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Fabrication and Characterization of FeNiCr Matrix-TiC Composite for Polishing CVD Diamond Film[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2009,25(3):319-324
- [250]王奔, 吴东江, 高航, 康仁科, Wu, D.-J.(djwudut@dlut.edu.cn).清洗方法对KDP晶体抛光表面质量的影响[J],人工晶体学报,2009,38(2):525-528,534
- [251]李岩, 王可, 吴东江, 高航, 康仁科, Li, Y.(liyan3278@sohu.com).碲锌镉晶体高效低损伤CMP工艺研究[J],人工晶体学报,2009,38(2):416-421
- [252]Guo, Dongming, Gao, Hang, Zhang, Zhenyu, Kang, Renke, ZY (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Nanocutting Process of CdZnTe Single Crystals[J],MATERIALS AND MANUFACTURING PROCESSES,2009,24(4):504-508
- [253]Wang Ben, Wu Dongjiang, Gao Hang, Kang Renke, Guo Dongming, Wang, B (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Subsurface Damage in Scratch Testing of Potassium Dihydrogen Phosphate Crystal[J],CHINESE JOURNAL OF MECHANICAL ENGINEERING,2009,22(1):15-20
- [254]王克欣, 盛贤君, 王永青, 康仁科, 佟宇, Wang, K.-X..天线罩电厚度测量的运动轨迹规划及实现[J],哈尔滨工业大学学报,2009,41(5):102-105
- [255]Qin, N., Guo, D. M., Kang, R. K., Huo, F. W..Effect of Conditioning Parameters on Surface Non-uniformity of Polishing Pad in Chemical Mechan...[A],2009,389-390:498-503
- [256]Guo D.M., Liu R.H., Kang R.K., Jin Z.J., Guo, D. M., Key Laboratory for Precision, Non-traditional Machining Technology, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: guodm@dlut.edu.cn.Study on adhesion removal model in CMP SiO2 ILD[J],Key Engineering Materials,2009,389-390:475-480
- [257]Huo F.W., Guo D.M., Kang R.K., Jin Z.J., Huo, F. W., Key Laboratory for Precision, Non Traditional Machining, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: huofengwei@sohu.com.Characteristics of the wheel surface topography in ultra-precision grinding of silicon wafers[J],Key Engineering Materials,2009,389-390:36-41
- [258]金洙吉, 康仁科.Fabrication and Characterization of FeNiCr Matrix-matrix-TiC composite for polishing CVD diamond ...[J],Journal of Material Science and Technology,2009,25(3):319-324
- [259]Dong, Z. G., Kang, R. K., Jia, Z. Y..Study on the Subsurface Damage of Single Crystal MgO Substrates[A],2009,389-390:7-12
- [260]Jin, Z. J., Yuan, Z. W., Kang, R. K., Dong, B. X..Study on Two kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film[A],2009,389-390:217-222