康仁科
个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会(International Committee of Abrasive Technology, ICAT)委员,中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员,中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员,中国机械工程学会特种加工分会超声加工技术委员会副主任,中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员,中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别:男
毕业院校:西北工业大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点:机械工程学院7191
电子邮箱:kangrk@dlut.edu.cn
扫描关注
- [261]Huo, F. W., Guo, D. M., Kang, R. K., Jin, Z. J..Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers[A],2009,389-390:36-41
- [262]Tian, Y. B., Kang, R. K., Zhou, L., Lei, M. K..Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasiv...[A],2009,389-390:459-+
- [263]Guo, D. M., Liu, R. H., Kang, R. K., Jin, Z. J..Study on adhesion removal model in CMP SiO(2) ILD[A],2009,389-390:475-480
- [264]Lu, C. P., Gao, H., Kang, R. K., Teng, X. J., Wang, Q. G..ULTRA-PRECISION MACHINING TECHNOLOGY OF THE SOFT AND BRITTLE FUNCTIONAL CRYSTAL[A],2009,669-676
- [265]Zhang, Y., Su, J., Gao, W., Kang, R., Y.(zhangyinxia@zzu.edu.cn).Study on subsurface damage model of the ground monocrystallinge silicon wafers[J],Key Engineering Materials,2009,416:66-70
- [266]Kang, R., Gao, S., Jin, Z., Guo, D., R.(gaoshangf@gmail.coml).Study on grinding performance of soft abrasive wheel for silicon wafer[J],Key Engineering Materials,2009,416:529-534
- [267]Wang Q., Pei Z.J., Gao H., Churi N.J., Kang R., Pei, Z. J., Department of Industrial, Manufacturing Systems Engineering, Kansas State University, Manhattan, KS 66506, United States, email: zpei@ksu.edu.Rotary ultrasonic machining of potassium dihydrogen phosphate (KDP) crystal: An experimental inve...[J],International Journal of Mechatronics and Manufacturing Systems,2009,2(4):414-426
- [268]Jin Z.J., Dong B.X., Yuan Z.W., Kang R.K., Jin, Z. J., Key Laboratory for Precision, Non-Traditional Machining Technology, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: kimsg@dlut.edu.cn.Study on two kinds of grinding wheels for dynamic friction polishing of CVD diamond film[J],Key Engineering Materials,2009,389-390:217-222
- [269]Dong Z.G., Jia Z.Y., Kang R.K., Dong, Z. G., Key Laboratory for Precision, Non-traditional Machining Technology, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: zhigangdong@126.com.Study on the subsurface damage of single crystal MgO substrates[J],Key Engineering Materials,2009,389-390:7-12
- [270]Qin N., Guo D.M., Kang R.K., Huo F.W., Qin, N., Key Laboratory for Precision, Non-traditional Machining Technology, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: tinaspirit@163.com.Effect of conditioning parameters on surface non-uniformity of polishing pad in chemical mechanic...[J],Key Engineering Materials,2009,389-390:498-503
- [271]Guo D.M., Zhou L., Lei M.K., Tian Y.B., Kang R.K., Guo, D. M., Key Laboratory for Precision, Non-traditional Machining, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: ybtian@dlut.edu.cn.Material removal mechanism of chemo-mechanical grinding (CMG) of Si wafer by using soft abrasive ...[J],Key Engineering Materials,2009,389-390:459-464
- [272]Zhang, Zhenyu, Zhou, Hongxiu, Guo, Dongming, Gao, Hang, Kang, Renke, ZY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Optical characterization of hydrogen-free CeO2 doped DLC films deposited by unbalanced magnetro...[J],APPLIED SURFACE SCIENCE,2008,255(5):2655-2659
- [273]张振宇, 郭东明, 康仁科, 高航, 李岩, Zhang, Z.(zzy@dlut.edu.cn).软脆功能晶体碲锌镉化学机械抛光[J],机械工程学报,2008,44(12):215-220,225
- [274]郜伟, 康仁科, 张银霞.大尺寸Si片自旋转磨削表面的损伤分布研究[J],半导体技术,2008,33(10):876-879,926
- [275]Zhang, Zhenyu, Gao, Hang, Jie, Wanqi, Guo, Dongming, Kang, Renke, Li, Yan, ZY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining Technol, Dalian 116024, Peoples R China..Chemical mechanical polishing and nanomechanics of semiconductor CdZnTe single crystals[J],SEMICONDUCTOR SCIENCE AND TECHNOLOGY,2008,23(10)
- [276]Guo, D.M., Qin, N., Kang, R.K., Jin, Z.J..Novel measurement technique on 3D surface topography of polishing pad[A],2008,53-54:265-272
- [277]Yuan, Z.W., Jin, Z.J., Dong, B.X., Kang, R.K..Polishing of free-standing CVD diamond films by the combination of EDM and CMP[A],2008,53-54:111-118
- [278]Wu, D.J., Wang, B., Gao, H., Kang, R.K., Cao, X.S..Influence of grinding to the surface and subsurface quality of KDP crystal[A],2008,53-54:203-208
- [279]Xu, C., Guo, D. M., Kang, R. K., Jin, Z. J., Huo, F. W..Friction-based in Situ Endpoint Detection of Copper CMP Process[A],2008,53-54:125-130
- [280]Zhang, Zhenyu, Huo, Fengwei, Jia, Zhenyuan, Guo, Dongming, Jin, Zhuji, Kang, Renke, ZY (reprint author), Dalian Univ Technol, Key Lab Precis & Non Tradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Optical properties of La(2)O(3) doped diamond-like carbon films[J],APPLIED SURFACE SCIENCE,2008,254(22):7193-7197