康仁科
个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会(International Committee of Abrasive Technology, ICAT)委员,中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员,中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员,中国机械工程学会特种加工分会超声加工技术委员会副主任,中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员,中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别:男
毕业院校:西北工业大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点:机械工程学院7191
电子邮箱:kangrk@dlut.edu.cn
扫描关注
- [141]周平, 戴恒震, 金洙吉, 王宇, 康仁科, 郭东明, Zhou, Ping.周向波度密封环预变形平面研磨加工中的变形分析[J],机械工程学报,2014,51(11):171-176
- [142]郭晓光, 金洙吉, 康仁科.Research on elastic-plastic transition and hardening effect on monocrystalline silicon surfaces[A],2014,101-106
- [143]张军, 钱敏, 康仁科, 任宗金.Development of piezoelectric three-dimensional dynamometer for φ300mm wafer grinder[A],2014,945:2017-2020
- [144]朱祥龙, 董志刚, 康仁科, 郭东明.Design of Double-Sided Polishing Machine for Functional Crystal Substrate. The International Symp...[A],2014,1017:580-585
- [145]董志刚, 高尚, 康仁科, 郭东明.Investigation on properties of magnesia grinding wheels used in silicon wafer grinding[A],2014,117(-):273-278
- [146]高尚, 康仁科, 郭晓光.Grinding performance of diamond grinding tools for sapphire crystal[A],2014,117(-):544-548
- [147]Zhang J., Qian M., Kang R., Ren Z., Wang W..Development of piezoelectric three-dimensional dynamometer for 300mm wafer grinder[A],2014,945-949:2017-2020
- [148]Zhou, Ping, Guo, Dongming, Kang, Renke, Jin, Zhuji, P (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..A mixed elastohydrodynamic lubrication model with layered elastic theory for simulation of chem...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2013,69(5-8):1009-1016
- [149]Feng Guang, Guo DongMing, Huo FengWei, Jin ZhuJi, Kang RenKe, Huo, FW (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Implementation strategies for high accuracy grinding of hydrodynamic seal ring with wavy face f...[J],SCIENCE CHINA-TECHNOLOGICAL SCIENCES,2013,56(10):2403-2412
- [150]吴东江, 杨策, 马广义, 康仁科, 吴楠, Wu, DJ (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..预热对Al2O3陶瓷激光熔覆层温度梯度影响的模拟[J],稀有金属材料与工程,2013,42(10):2039-2042
- [151]Zhou, Ping, Kang, Renke, Shi, Kang, Guo, Dongming, Shan, Kun, Li, Zhe, P (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Numerical studies on scavenging reaction in confined etchant layer technique (CELT)[J],JOURNAL OF ELECTROANALYTICAL CHEMISTRY,2013,705:1-7
- [152]Zhang, Zhenyu, Li, Fangyuan, Ma, Guojun, Kang, Renke, Guo, Xiaoguang, ZY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian, Peoples R China..Ultrahigh hardness and improved ductility for nanotwinned mercury cadmium telluride[J],SCRIPTA MATERIALIA,2013,69(3):231-234
- [153]Zhang, Zhenyu, Nianmin, Ma, Guojun, Kang, Renke, ZY (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Characterization of microstructural stability for nanotwinned mercury cadmium telluride under c...[J],SCRIPTA MATERIALIA,2013,69(4):299-302
- [154]刘书田, 董志刚, 周平, 胡瑞, 康仁科, Liu, S.-T.(stliu@dlut.edu.cn).基于筋板式基结构的大口径空间反射镜构型设计的拓扑优化方法[J],光学精密工程,2013,21(7):1803-1810
- [155]Huo, Fengwei, Guo, Dongming, Li, Zhe, Feng, Guang, Kang, Renke, FW (reprint author), Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Liaoning Provin, Peoples R China..Generation of rotationally symmetric surfaces by infeed grinding with a rotary table and a cup ...[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2013,37(2):286-298
- [156]Gao, Shang, Guo, Dongming, Kang, Renke, Dong, Zhigang, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, 2 Linggong Rd, Dalian 116023, Peoples R China..Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2013,227(B4):578-586
- [157]霍凤伟, 郭东明, 冯光, 康仁科, 金洙吉, Huo, F.(huofw@dlut.edu.cn).核主泵用斜波纹面型密封环超精密磨削方法[J],机械工程学报,2013,49(5):154-160
- [158]Huo, F. W., Kang, R. K., Li, Z., Guo, D. M., FW (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafer...[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE,2013,66:54-65
- [159]高尚, 郭东明, 董志刚, 康仁科, Kang, R.(kangrk@dlut.edu.cn).工件旋转法磨削硅片的亚表面损伤分布[J],机械工程学报,2013,49(3):88-94
- [160]Tang, Keyan, Kang, Renke, Guo, Dongming, Song, Li, KY (reprint author), Chengdu Univ Technol, Fac Automat Engn, Engn & Technol Coll, Leshan 614007, Peoples R China..Modeling and investigation on wafer shape in wafer rotational grinding method[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2013,64(5-8):707-714