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Indexed by:会议论文

Date of Publication:2011-12-16

Included Journals:EI、CPCI-S、Scopus

Volume:418-420

Page Number:936-939

Key Words:electroless Ni-P plating; AZ91D magnesium alloy; deposition rate; deposition reaction dynamics

Abstract:The effects of the concentrations of NiSO4 center dot 6H(2)O, NaH2PO2 center dot H-2 and complexing agents in bath, temperature, pH, SiC concentration etc. on deposition rate of electroless Ni-P plating were systematically studied. The appropriate deposition rate of electroless Ni-P plating (17 mu m h(-1)) was obtained at the optimal conditions. The deposition reaction dynamics of electroless Ni-P plating on AZ91D magnesium alloy was discussed and the corresponding kinetic model was also determined based on the corresponding experimental results.