Release Time:2019-03-11  Hits:

Indexed by: Conference Paper

Date of Publication: 2011-12-16

Included Journals: Scopus、CPCI-S、EI

Volume: 418-420

Page Number: 936-939

Key Words: electroless Ni-P plating; AZ91D magnesium alloy; deposition rate; deposition reaction dynamics

Abstract: The effects of the concentrations of NiSO4 center dot 6H(2)O, NaH2PO2 center dot H-2 and complexing agents in bath, temperature, pH, SiC concentration etc. on deposition rate of electroless Ni-P plating were systematically studied. The appropriate deposition rate of electroless Ni-P plating (17 mu m h(-1)) was obtained at the optimal conditions. The deposition reaction dynamics of electroless Ni-P plating on AZ91D magnesium alloy was discussed and the corresponding kinetic model was also determined based on the corresponding experimental results.