点击次数：

论文类型：期刊论文

发表时间：2013-12-01

发表刊物：Guangxue Jingmi Gongcheng/Optics and Precision Engineering

收录刊物：EI、PKU、ISTIC、Scopus

卷号：21

期号：SUPPL

页面范围：69-75

ISSN号：1004924X

摘要：The fabrication of micro coils based on Micro-electronic-Mechanical System (MEMS) was researchech and a SU-8 mould was prepared by the UV-LIGA process. A sulfate copper electroforming process using dye additives was studied by experiments and then it was applied in the fabrication of micropatterns. First, the seed layer fabrication was analyzed and the copper sputtering and resist lift-off process were selected to obtain the copper seed layer on a Si substrate, and a SU-8 mould was fabricated with the SU-8 photoresist UV-lithography process. Then, a simple electroforming device was put up, the additives such as honey and dye were used in the electroforming experiments to analyze technological problems and to remove the defects such as spots, black coatings, burning and dye deposition. Furthermore, the mature process of micro electroforming was achieved. Final, copper coils with the minimum linewidth of 10   m and height of 15   m were fabricated by the precise electroforming equipment. The results verify the feasibility of copper electroforming process, which means that the proposed process can meet the requirement of micropattern electroforming.