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论文类型：期刊论文

发表时间：2013-12-01

发表刊物：MICRO & NANO LETTERS

收录刊物：SCIE、EI、Scopus

卷号：8

期号：12

页面范围：872-876

ISSN号：1750-0443

关键字：adhesion; copper; current density; electroforming; micromechanical devices; nickel; surface treatment; microfabrication; electrochemical activation; substrate surfaces; microelectroforming; manufacturing process; metal microstructures; microelectronic mechanical system; current density; cathodic overpotential; chronopotentiometric method; substrate activation; adhesion strength; Cu; Ni

摘要：Microelectroforming is a modern manufacturing process for producing metal microstructures in the field of microelectronic mechanical systems. Electrochemical activation of the substrate surfaces can enhance the adhesion strength between the electroforming layer and the substrate at the first stage of microelectroforming. The mechanism of current density affecting the activation of the substrate surfaces was explored. The cathodic overpotential was carried out with the chronopotentiometric method under different current density conditions. The current density at the first stage of microelectroforming was the largest contributor to the electrochemical activation of the substrate surfaces. As the current density was set in the range of 0.2-1.2 A/dm(2), effective electrochemical activation occurred on the substrate surfaces. Although the current density was 0.4 A/dm(2), the effect of substrate activation is optimal and the adhesion strength between the electroforming layer and the substrate reached its maximum.