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Indexed by:会议论文

Date of Publication:2016-08-16

Included Journals:EI、CPCI-S、SCIE、Scopus

Page Number:608-611

Key Words:Soldering; Synchrotron radiation; Intermetallic compounds; Thermal conductivity; Finite element analysis

Abstract:Synchrotron radiation x-ray imaging technique was applied for in-situ observation of interfacial bubbles in Cu/molten Sn-3.5Ag/Cu joint undergoing thermomigration. The heating plate temperature was maintained at 350 degrees C and reflow time of 1 h was considered. Interfacial bubbles at hot side, favoured by wetting transition for growth, increase the effective thermal gradient in the solder medium. The interfacial voids lower the resistance of Sn-based solder joints to thermomigration. The numerical model for effective thermal conductivity and heat transfer in the inhomogeneous medium was implemented using finite element method.