Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Scientific Research
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Paper Publications
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- Ma, H. R..Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Zhao, N.,Wang, Y. P.,Li, X. G.,Ma, H. T.,Chen, J.,Dong, C..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
- Qiao, Y. Y..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, H. T.,Zhao, N.,Liu, C. Y.,Wu, C. M. L.,Wang, Y. P..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient[J],MATERIALS TODAY COMMUNICATIONS,2020,23
- Gao, Zhaoqing.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Sun, Hao,Dong, Chong,Ma, Haitao,Wang, Yunpeng,Cao, Jinwei,Muzammal , Hussain Muhammad,Wang, Chen.Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly uniformed nanoporous arrays[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
- Zhu, Zhidan.Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Ma, HR (reprint author), Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China..Li, Xiaogan,Ma, Haitao,Wang, Yunpeng,Ma, Haoran,Shang, Shengyan.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
- Shang, Shengyan.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Kunwar, Anil,Yao, Jinye,Ma, Haitao,Wang, Yunpeng.Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux[J],THIN SOLID FILMS,2019,669:198-207
- Yao, Mingjun.Zhao, N; Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300, Peoples R China..Ma, Haitao,Zhao, Ning,Wang, Teng,Yu, Daquan,Xiao, Zhiyi.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
Patents
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Published Books
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Research Projects
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- 0204-P-901B泵轴断裂检测,企事业单位委托科技项目,2018-03-16,2020-06-30,结题
- E101A 、E101B、E101C 管束及相关换热器壳体外壁及相应管线金相复膜分析,企事业单位委托科技项目,2018-03-05,2020-06-30,结题
- 工程材料原位研究方法示范应用,国家科技部,2017-07-15,2023-12-15,结题
- 1#炉爆裂导淋管失效分析,企事业单位委托科技项目,2018-01-12,2020-06-30,结题
- 现场金相检测分析及评估,企事业单位委托科技项目,2017-12-18,2020-06-30,结题
- 化肥厂一段炉旧管座理化分析,企事业单位委托科技项目,2017-09-12,2020-06-30,结题