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倒装芯片用全金属间化合物互连焊点的制备方法及结构

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First Author:Zhao Ning

Disigner of the Invention:Mingliang Huang,钟毅,mahaitao,刘亚伟,huangfeifei

Application Number:CN201510068044.2

Authorization Date:2015-02-09

Authorization number:CN104716058A

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