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倒装芯片用全金属间化合物互连焊点的制备方法及结构

Release Time:2019-10-14  Hits:

First Author: 赵宁

Disigner of the Invention: 黄斐斐,刘亚伟,马海涛,钟毅,Mingliang Huang

Application Number: CN201510068044.2

Authorization Date: 2015-02-09

Authorization Number: CN104716058A

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