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马海涛
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Patents
[1] 一种电子封装微焊点的制备方法
[2] 一种管道外径尺寸相对变化量的连续测量装置
[3] 一种全金属间化合物窄间距微焊点的制备方法及结构
[4] HP型制氢炉炉管的组织劣化程度监测方法及装置
[5] 倒装芯片用全金属间化合物互连焊点的制备方法及结构
[6] 一种三维封装芯片堆叠用金属间化合物键合方法及键合结构
[7] 金属间化合物填充三维封装垂直通孔及其制备方法
[8] 一种金属间化合物薄膜的制备方法
[9] 一种用于铝铜软钎焊的Sn-Zn-Ni无铅钎料合金
[10] 一种弱碱性锡基无铅钎料复合镀液及其应用
TOTAL 23 PIECE 1/3
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