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金属间化合物填充三维封装垂直通孔及其制备方法

Release Time:2019-10-14  Hits:

First Author: Mingliang Huang

Disigner of the Invention: 马海涛,赵杰,张飞,杨帆,张志杰,赵宁

Application Number: CN201510069932.6

Authorization Date: 2015-02-09

Authorization Number: CN104701283A

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