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一种三维封装芯片堆叠用金属间化合物键合方法及键合结构

Release Time:2019-10-14  Hits:

First Author: 赵宁

Disigner of the Invention: 马海涛,许利伟,赵建飞,钟毅,Mingliang Huang

Application Number: CN201510069934.5

Authorization Date: 2015-02-09

Authorization Number: CN104716059A

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