Release Time:2019-03-11  Hits:

Indexed by: Conference Paper

Date of Publication: 2010-06-26

Included Journals: Scopus、CPCI-S、EI

Volume: 675-677

Page Number: 1213-1216

Key Words: mould copper plate; surface modified layer; W-Cu alloys; infiltration; bonding strength

Abstract: In this paper, a new method named infiltration was applied to fabricate W-Cu surface modified layers of copper mould firstly in order to promote the life span of the continuous casting machine (CCM) mould. Our efforts concentrated on fabricating the W-Cu modified layers on the surface of mould copper plate by presintering and infiltration under inert gases. The W particle size and sintering temperature of W skeleton were adjusted to gain homogeneous microstructure of W-Cu modified layers. The results show that homogeneous microstructure of W-Cu modified layers can be obtained with the method of presintering and infiltration. For the excellent microstructure of W-Cu modified layers, the suitable tungsten particle size is 300 meshes and the optimal presintering temperature is about 1300 degrees C. W-Cu modified layers have good bonding strength with copper substrate.