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Indexed by:期刊论文
Date of Publication:2009-01-01
Journal:理化检验-物理分册
Included Journals:ISTIC
Volume:45
Issue:9
Page Number:37-39
Pre One:热电厂水冷壁管穿孔泄露原因分析。2009，45316-319
Next One:Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during soldering and aging
