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Indexed by:期刊论文
Date of Publication:2011-01-01
Journal:The proceedings of the china association for science and technology
Volume:7
Issue:2
Page Number:138-143
Pre One:Effect if soldering Temperature and Cooling Rate on the As-soldered Microstructures of Intermetallic Compounds in Sn-Ag/Cu Joint
Next One:The fabrication of W-Cu modified layers on the surface of the continuous casting machine mould copper plate by infiltration: , v 675 677, p 1213-1216, 2011 EI
