Hits:
Indexed by:会议论文
Date of Publication:2016-01-01
Volume:1
Issue:1
Page Number:273-276
Pre One:On the increase of intermetallic compounds thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
Next One:Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage
