大连理工大学主页平台管理系统马海涛 Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect Home

Current position: Home >> Scientific Research >> Paper Publications

Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect

Release Time:2019-03-12 Hits:

Indexed by: Journal Article

Date of Publication: 2017-01-01

Journal: Applied Physics Letters

Volume: 110

Issue: 9

Page Number: 93504-

Prev One:Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn under Thermal Gradient

Next One:Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient