Hits:
Indexed by:期刊论文
Date of Publication:2012-01-01
Journal:焊接
Included Journals:PKU、ISTIC
Issue:5
Page Number:28-32
Pre One:刘晓英;马海涛;罗忠兵; 赵艳辉; 黄明亮; 王来 Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响
Next One:The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate