Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172(2016) 211-215]
Release Time:2019-03-13 Hits:
Indexed by: Journal Article
Date of Publication: 2018-01-01
Journal: Materials Letter
Included Journals: EI、SCIE
Volume: 230
Page Number: 76-76