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Indexed by:Journal Papers

Date of Publication:2015-10-01

Journal:SCRIPTA MATERIALIA

Included Journals:SCIE、EI、Scopus

Volume:107

Page Number:88-91

ISSN No.:1359-6462

Key Words:Electromigration; Synchrotron radiation; Inter-metallic compound; Finite volume method; Level-set variable

Abstract:Synchrotron radiation imaging technology was applied for in situ observation of the growth of Cu6Sn5 intermetallic compounds at the anode in Cu/molten Sn/Cu joint undergoing electromigration. For current density of 0.6 x 10(3) A/cm(2), temperature of 250 degrees C and reflow heating time of 1 h, thickness of the compound was obtained as 110 gm. The thickness growth was observed to have linear dependence with time. The numerical model for diffusion and electromigration of the copper species was implemented using the finite volume method. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.