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Indexed by:期刊论文

Date of Publication:2012-10-05

Journal:JOURNAL OF ALLOYS AND COMPOUNDS

Included Journals:SCIE、EI、Scopus

Volume:537

Page Number:286-290

ISSN No.:0925-8388

Key Words:Synchrotron radiation; Ag3Sn; Intermetallic compounds; Crystal structure; Competitive growth

Abstract:The growth behavior of Ag3Sn intermetallic compound (IMC), forming in the Sn-3.5Ag/Cu soldering solidification process, was in situ investigated by the synchrotron radiation real-time imaging technology. Three Ag3Sn growth patterns were observed, i.e., linear, Y and X shape, which were primarily related to the crystal structure of Ag3Sn. The size of linear Ag3Sn was larger than those of other shapes. For each pattern, growth velocity of each direction was almost the same. Competitive growth of Ag3Sn was also found in the early stage of solidification process. Most of Ag3Sn were dissolved and only some of them could grow up to the end. (C) 2012 Elsevier B.V. All rights reserved.