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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[111]郭林海, 吴爱民, 马海涛, 王来.热电厂水冷壁管泄漏失效分析[A],2013,Vol.49:477-479
[112]An, Lili, Ma, Haitao, Qu, Lin, Wang, Jie, Liu, Jiahui, Huang, Mingliang.The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction[A],2013,264-267
[113]Huang, Mingliang, Zhou, Qiang, Ma, Haitao, Zhao, Jie.Effect of Liquid-solid Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu Solder Joint[A],2013,1090-1093
[114]Zhao, Huijing, Li, Hua, Ning, Ma, Haitao, Qu, Lin.The study of cooling process' effect on the growth of IMC at Sn-3.5Ag/Cu soldering interface[A],2013,372-376
[115]Qu, Lin, Ma, Haitao, Zhao, Huijing, Ning, Kunwar, Anil, Huang, Mingliang.The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5[A],2013,377-381
[116]Huang, Mingliang, Ma, Haitao, Zhao, Jie, Yang, Yaochun, Hou, Xianlin.Interfacial Reaction and Mechanical Properties of Al/Sn-Zn-Ni/Cu Solder Joints[A],2013,879-882
[117]Li, Hua, Qu, Lin, Zhao, Huijing, Ning, Ma, Haitao.Mechanism of Cu6Sn5 layer act as a diffusion barrier layer[A],2013,1086-1089
[118]Ma, Hai-Tao, Wang, Jie, Qu, Lin, Zhao, Ning, Kunwar, A., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solid...[J],JOURNAL OF ELECTRONIC MATERIALS,2013,42(8):2686-2695
[119]郝相民, 郭超, 孙长海, 郭林海, 马海涛, 王来.HP型炉管破裂失效分析[J],中国机械,2013,17:158-160
[120]曲豫, 马海涛, 韦良, 孙长海, 郭超.基于超声检测的炼油厂HP型制氢炉管劣化分级方法[J],中国机械,2013,17:188-189

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