Release Time:2019-03-09 Hits:
First Author: Mingliang Huang
Disigner of the Invention: 张飞,杨耀春,赵杰,马海涛,赵宁
Authorization Number: ZL201320660117.3
Prev One:一种三维封装芯片堆叠用金属间化合物键合方法及键合结构
Next One:黄明亮,赵宁,马海涛,赵杰,杨耀春,张飞。一种测定微电子封装焊点压缩蠕变性能的测试装置