Hits:
First Author:Mingliang Huang
Disigner of the Invention:Zhao Ning,mahaitao,Zhao Jie,杨耀春,张飞
Authorization number:ZL201320660117.3
Pre One:一种三维封装芯片堆叠用金属间化合物键合方法及键合结构
Next One:黄明亮,赵宁,马海涛,赵杰,杨耀春,张飞。一种测定微电子封装焊点压缩蠕变性能的测试装置