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论文类型：会议论文

发表时间：2016-08-16

收录刊物：EI、CPCI-S、Scopus

页面范围：166-169

关键字：Phase change; Finite element method; Apparent heat capacity; Enthalpy method; Solder

摘要：The temperature and velocity distribution during the transient melting phase change in Sn-0.7Cu solder alloy has been modelled using finite element method. The simulation of melting front dynamics has been performed by an Eulerian method, commonly known as enthalpy method. CALPHAD technique is utilized for the computation of enthalpy of the solder material. The flow in the liquid regime of the solder is assumed incompressible and natural convection effects are incorporated through the Boussinesq approximation. The asymptotic viscosity is employed for the mushy zone. For a horizontal finite temperature gradient imposed on the square domain, the mushy zone is thinner at the upper half whereas thicker at the lower of the initially liquid region. Consequently, the melting front within the temperature range 500 K- 503 K moves faster towards the solid in the upper portion of the geometry. The velocity at the peripherial zones of the liquid undergoing convection flow reaches its maximum magnitude of 13 mm/s.