|
个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
办公地点：材料馆332
联系方式：15641188312
电子邮箱：htma@dlut.edu.cn
扫描关注
- Ma, H. R., Dong, C., Zhao, N., Wang, Y. P., Li, X. G., H. T., Chen, J., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
- Qiao, Y. Y., Wu, C. M. L., Wang, Y. P., Ma, H. T., Zhao, N., Liu, C. Y., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient[J],MATERIALS TODAY COMMUNICATIONS,2020,23
- Gao, Zhaoqing, Cao, Jinwei, Muzammal , Hussain Muhammad, Wang, Chen, Sun, Hao, Dong, Chong, Ma, Haitao, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly uniformed nanoporous arrays[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
- Zhu, Zhidan, Ma, Haoran, Shang, Shengyan, Haitao, Wang, Yunpeng, Li, Xiaogan, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Ma, HR (reprint author), Sch Microelect.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
- Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Ma, Haitao, Wang, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux[J],THIN SOLID FILMS,2019,669:198-207
- Yao, Mingjun, Zhao, Ning, Wang, Teng, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
- 0204-P-901B泵轴断裂检测, 企事业单位委托科技项目, 2018/03/16-2020/06/30, 结题
- E101A 、E101B、E101C 管束及相关换热器壳体外壁及相应管线金相复膜分析, 企事业单位委托科技项目, 2018/03/05-2020/06/30, 结题
- 工程材料原位研究方法示范应用, 国家科技部, 2017/07/15-2023/12/15, 结题
- 1#炉爆裂导淋管失效分析, 企事业单位委托科技项目, 2018/01/12-2020/06/30, 结题
- 现场金相检测分析及评估, 企事业单位委托科技项目, 2017/12/18-2020/06/30, 结题
- 化肥厂一段炉旧管座理化分析, 企事业单位委托科技项目, 2017/09/12-2020/06/30, 结题