马海涛

个人信息Personal Information

教授

博士生导师

硕士生导师

性别：男

毕业院校：大连理工大学

学位：博士

所在单位：材料科学与工程学院

办公地点：材料馆332

联系方式：15641188312

电子邮箱：htma@dlut.edu.cn

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[1]Ma, H. R., Dong, C., Zhao, N., Wang, Y. P., Li, X. G., H. T., Chen, J., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
[2]Qiao, Y. Y., Wu, C. M. L., Wang, Y. P., Ma, H. T., Zhao, N., Liu, C. Y., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates ...[J],MATERIALS TODAY COMMUNICATIONS,2020,23
[3]Gao, Zhaoqing, Cao, Jinwei, Muzammal , Hussain Muhammad, Wang, Chen, Sun, Hao, Dong, Chong, Ma, Haitao, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly...[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
[4]Zhu, Zhidan, Ma, Haoran, Shang, Shengyan, Haitao, Wang, Yunpeng, Li, Xiaogan, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Ma, HR (reprint author), Sch Microelect.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interfac...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
[5]Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Ma, Haitao, Wang, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints r...[J],THIN SOLID FILMS,2019,669:198-207
[6]Yao, Mingjun, Zhao, Ning, Wang, Teng, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Ad...[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
[7]Kunwar, Anil, Zhao, Ning, Huang, Mingliang, Ma, Haoran, Haitao, Sun, Junhao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2018,230:76-76
[8]Yao, Mingjun, Ma, Haitao, Xiao, Zhiyi, Yu, Daquan, Wang, Teng, Zhao, Ning, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatt...[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1855-1862
[9]Zhong, Y., Zhao, N., Dong, W., Wang, Y. P., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/...[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
[10]Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Wang, Yunpeng, Zhao, Ning, Huang, Mingliang, Ma, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
[11]Shang, Shengyan, Wang, Yunpeng, Ma, Haitao, Qi, Xiao, Yanfeng, Kunwar, Anil, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synthesis of Cu@Ag core-shell nanoparticles for characterization of thermal stability and elect...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2018,124(7)
[12]Ma, H. R., Kunwar, A., Shang, S. Y., Jiang, C. R., Wang, Y. P., H. T., Zhao, N., HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during mul...[J],INTERMETALLICS,2018,96:1-12
[13]Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Raback, Peter, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205
[14]Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and coolin...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[15]Guo, Bingfeng, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[16]Zhao, N., Wang, M. Y., Zhong, Y., Ma, H. T., Y. P., Wong, C. P., N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on Cu-Ni cross-interaction in Cu/Sn-xZn/Ni micro solder joints[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5064-5073
[17]Kunwar, Anil, Guo, Bingfeng, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2018,93:186-196
[18]Yao, Mingjun, Zhao, Ning, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao.Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesiv...[A],2018,241-246
[19]Zhao, Ning, Chen, Shi, Liu, Chunying, Zhong, Yi, Ma, Haitao, Wang, Yunpeng.Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient[A],2018,603-606
[20]马海涛, 赵宁, 王云鹏.Stability of multilayered Ag/Ag3Sn/Sn films noncyanide electroplateded for high-reflective back-e...[A],2018,396-399

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