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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
办公地点：材料馆332
联系方式：
电子邮箱：
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- [1]Ma, H. R..Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Zhao, N.,Wang, Y. P.,Li, X. G.,Ma, H. T.,Chen, J.,Dong, C..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
- [2]Qiao, Y. Y..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, H. T.,Zhao, N.,Liu, C. Y.,Wu, C. M. L.,Wang, Y. P..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient[J],MATERIALS TODAY COMMUNICATIONS,2020,23
- [3]Gao, Zhaoqing.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Sun, Hao,Dong, Chong,Ma, Haitao,Wang, Yunpeng,Cao, Jinwei,Muzammal , Hussain Muhammad,Wang, Chen.Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly uniformed nanoporous arrays[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
- [4]Zhu, Zhidan.Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Ma, HR (reprint author), Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China..Li, Xiaogan,Ma, Haitao,Wang, Yunpeng,Ma, Haoran,Shang, Shengyan.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
- [5]Shang, Shengyan.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Kunwar, Anil,Yao, Jinye,Ma, Haitao,Wang, Yunpeng.Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux[J],THIN SOLID FILMS,2019,669:198-207
- [6]Yao, Mingjun.Zhao, N; Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300, Peoples R China..Ma, Haitao,Zhao, Ning,Wang, Teng,Yu, Daquan,Xiao, Zhiyi.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
- [7]Kunwar, Anil.Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Huang, Mingliang,Ma, Haitao,Sun, Junhao,Zhao, Ning,Ma, Haoran.On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016)[J],MATERIALS LETTERS,2018,230:76-76
- [8]Yao, Mingjun.Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, Haitao,Wang, Teng,Yu, Daquan,Xiao, Zhiyi,Zhao, Ning.Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1855-1862
- [9]Zhong, Y..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, H. T.,Zhao, N.,Dong, W.,Wang, Y. P..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
- [10]Shang, Shengyan.Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Zhao, Ning,Huang, Mingliang,Ma, Haitao,Yao, Jinye,Wang, Yunpeng,Kunwar, Anil.All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972