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论文类型：会议论文

发表时间：2013-08-11

收录刊物：SCIE、EI、CPCI-S、Scopus

页面范围：879-882

关键字：Al-Cu solder joint; Sn-Zn-Ni; intermetallic compound; mechanical property; electrochemical corrosion behavior

摘要：Sn-Zn-Ni lead-free solders with different Ni and Zn contents were used to join Al and Cu substrates in the present work. Coarsened Ni3Zn14 and needle-like Zn-rich phases dispersed in the beta-Sn matrixes of the four Sn-Zn-Ni solders. The solders all showed good wettability on Al substrate and the 2# solder was the best. While the wettability on Cu substrate decreased with increasing Zn content. In the Al/Sn-Zn-Ni/Cu solder joints, Cu-Zn intermetallic compounds (IMCs) formed at the solder/Cu interface, while Al-Zn-Sn solid solutions formed at the Al/solder interface. Furthermore, Al3Ni phases dispersed in the bulk solders. The shear tests of the solder joints showed that the failures occurred at the Al/solder interface. This is attributed to the relatively lower bonding strength between Al-Zn-Sn solid solution and Al substrate compared to that between Cu-Zn IMC and Cu substrate. The addition of Zn enhanced the dissolution of Al substrate into the molten solder, which made the Al interface more uneven, further improved the shear strength of Al/Sn-ZnNi/Cu solder joints. The addition of Ni improved the corrosion resistances of the Sn-Zn-Ni solders.